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Keywords: Cycle times
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1997) 9 (1): 4–7.
Published: 01 June 1997
... of foot prints has reduced costs by ensuring that only one unique footprint exists for a particular package style, therefore reducing the number of different dedicated dies that are needed to build a particular assembly, and thus reducing the overall build cycle time. Establishing a standard solder mask...
