... of the substrate surface. Then pseudo‐virtual object parameters are calculated. Major attributes of the proposed measurement method is its insensitivity to both the specific location of the printed deposit and the location of a specific defect. This algorithm, coupled with variables defined in the analysis package...

... © MCB UP Limited 2001 --> Montford Defects Suspects put on The Rack and then Harassed Keywords: Montford, Defects Montford Instruments has released a new product range known as The Rack, to complement their range of HARASS rapid stress screening products used...

...Ning‐Cheng Lee A reflow profile is proposed which is engineered to optimize soldering performance based on defect mechanism analysis. In general, a slow ramp‐up rate is desired in order to minimize hot slump, bridging, tombstoning, skewing, wicking, opens, solder beading, solder balling...

... of solder paste) melts, reflows, then solidifies, and finally deforms between the chip and board. A number of defects may occur during this process such as flux entrapment, void formation, and cracking of the joint, chip or board. These defects are a serious concern to industry, especially with trends...