...Fei Chong Ng; Aizat Abas; Mohamad Riduwan Ramli; Mohamad Fikri Mohd Sharif; Fakhrozi Che Ani Purpose This paper aims to study the interfacial delamination found in the boundary of the copper/copper-epoxy layers of a multi-layer ceramic capacitor. Design/methodology/approach The thermal reflow...

... was investigated and evaluated. The influence of the barrier layers on the extent of underfill delamination and degradation in flip chip assemblies was inspected by C‐mode Scanning Acoustic Microscopy. The moisture barrier layers studied show their potential to enhance the reliability of flip chip assemblies...

... ∼100 cycles to more than 2,000 cycles for a chip size of 5.6mm × 6.3mm. By combining electrical, acoustic and metallographic investigation, the degradation of the solder joints was monitored, some important factors relevant to solder joint reliability were analysed and discussed. Delamination was found...

.... The performance of the underfill encapsulants was assessed by a statistical analysis of the failure distribution of the FCOB assemblies. The failure modes in the thermal cycling test were found to be solder joint cracks, delamination at underfill/chip passivation interface, and underfill internal cracks...