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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2026) 38 (2): 140–145.
Published: 25 December 2025
... by 17°C, and the metal interconnection effectively improved the heat dissipation efficiency. Originality/value Although epoxy had a high thermal conductivity, the adhesive detached at high temperature. The simulation results showed that at an ambient temperature of 90°C, the SiP’s temperature...
