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Keywords: Die‐attach
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Journal Articles
Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nanosilver paste
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2013) 25 (2): 107–116.
Published: 05 April 2013
... means that sintered nanosilver is not suitable for die‐attachment requiring thick bondline. Originality/value The paper describes: how a precise optical system was developed to measure the residual curvature of the sintered assemblies; how the evolution of the residual curvature of the sintered...
