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Keywords: Die bonding
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2000) 12 (1): 40–44.
Published: 01 April 2000
... achievable for Au/Si eutectic bonding, and the bonds show no obvious degradation after 2,800 cycles between –55°C to 125°C. © MCB UP Limited 2000 Die bonding Microstructures Reliability Die bonding is an important process step within electronic packaging with a significant impact...
