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Keywords: Dissolution behavior
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Journal Articles
Interfacial reaction and dissolution behavior of Cu substrate in molten Sn‐3.8Ag‐0.7Cu in the presence of Mo nanoparticles
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Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (3): 140–149.
Published: 28 June 2011
... into the Sn‐3.8Ag‐0.7Cu (SAC) solder paste. The dissolution behavior of Cu substrate is studied for SAC and Mo nanoparticles added SAC solders. The IMCs and its microstructure between the solder and substrate are analyzed by using conventional scanning electron microscope (SEM) and field emission SEM...
