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Keywords: Electrical connections
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (2): 18–26.
Published: 01 April 2006
... to the Cu metallization was (Cu1−y,Niy)6Sn5, for which the value of y remained around 0.21. Solders Metallurgy Organometallic compounds Electrical connections Electronic packaging of electronic products provides the medium...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (2): 27–32.
Published: 01 April 2006
... interfaces because the saturated concentration values are not the same for different materials. This problem can be easily solved by using the wetness fraction approach (Wong et al., 1998). © Emerald Group Publishing Limited 2006 Modelling Moisture Electrical connections...
