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Keywords: Electro-thermal-vibration coupling
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2025) 37 (3): 205–222.
Published: 10 March 2025
.... Design/methodology/approach In this study, memory-computing integrated chiplet-based 2.5D packaging was designed and the warpage optimization under electro-thermal-vibration coupling was conducted with finite element analysis simulation. Compared studies were also conducted with the imposing condition...
