Update search
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
NARROW
Format
Journal
Type
Date
Availability
1-3 of 3
Keywords: Electrodeposition
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (1): 24–32.
Published: 16 January 2020
... to electroplating, the copper substrates were cleaned with dilute H2SO4 and washed with running water. Figure 1 The pulse plating set-up used in the study Nucleation Morphology Tin Galvanostatic measurements Pulse electrodeposition Pulse plating Electrodeposition Sn-Cu...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2013) 25 (2): 76–90.
Published: 05 April 2013
...Yingxin Goh; A.S.M.A. Haseeb; Mohd Faizul Mohd Sabri Purpose The purpose of this paper is to enhance the understanding on the electrodeposition of various lead (Pb)‐free solder alloys, so that new studies can be carried out to solve processing issues. Design/methodology/approach The paper...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (3): 22–35.
Published: 29 June 2010
... Group Publishing Limited 2010 Electrodeposition Coating processes Metals Thermal testing A post‐processed deposit layer is a useful solution to avoid the above‐mentioned problems. Therefore, an electroless NiAu (ENIG) surface finish has been used in LTCC packages with a high...
