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Keywords: Electronic equipment and components
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Journal Articles
The evolution of paste pressure during stencil printing
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2007) 19 (3): 9–14.
Published: 03 July 2007
... Equation 29 Equation 30 Equation 31 Equation 32 Equation 33 Equation 34 Modelling Electronic equipment and components Print media Printed circuits Pressure Flip‐chip bonding and wafer‐level bumping are becoming important...
