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Keywords: Electronic packaging design
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2023) 35 (5): 288–304.
Published: 02 August 2023
... simulation and iterative process leading to a significant consumption of computational resources and time. In recent years, surrogate modeling techniques have also been applied to the field of electronic packaging design to alleviate the heavy computational burden (Chou et al., 2019 ; Yin et al...
