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Keywords: Elements diffusion
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (2): 85–91.
Published: 03 April 2017
...Yan Zhu; Fenglian Sun Purpose The purpose of this paper is to investigate the effect of geometric size on intermetallic compound (IMC) growth and elements diffusion of Cu/Sn/Cu solder joint and establish the correlation model between the thickness of the IMC layer and size of the solder joint...
