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Keywords: Encapsulation,Encapsulant materials,Electronics
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (2)
Published: 01 August 2004
... © Emerald Group Publishing Limited 2004 --> Encapsulation,Encapsulant materials,Electronics New DYMAX electronics encapsulant is ultra-flexible Keywords: Encapsulation, Encapsulant materials,Electronics Curing in seconds upon exposure to UV/visible light, DYMAX...
