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1-4 of 4
Keywords: Epoxy resins
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (2): 40–45.
Published: 01 April 2006
... the curing process play an important role in determining the electrical properties of the ICA specimens, even after a subsequent annealing process at high temperature (above the curing temperature). © Emerald Group Publishing Limited 2006 Adhesives Electrical properties Epoxy resins...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2005) 17 (4)
Published: 01 December 2005
... © Emerald Group Publishing Limited 2005 --> Epoxy resins New flip-chip underfill now available from Henkel Keywords: Epoxy resins Hysol ® FP4548FC provides superior fracture resistance; improves thermal cycling performance The electronics group...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2005) 17 (2)
Published: 01 June 2005
... Plate 3 The Master Bond EP121AO epoxy resin compound has been formulated for service temperatures up to 500°F The Master Bond EP121AO epoxy resin compound is comprised of a specially developed heat resistant liquid epoxy resin and a unique curing agent which exhibits unexcelled...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2005) 17 (1)
Published: 01 March 2005
... © Emerald Group Publishing Limited 2005 --> Epoxy resins New Master Bond Polymer System EP41S-4 Keywords: Epoxy resins Master Bond Polymer System EP41S-4 is a two component fast curing epoxy resin system specially designed for high security potting...
