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Keywords: Equivalent stress
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2025) 37 (1): 25–36.
Published: 07 November 2024
...Fang Liu; Zhongwei Duan; Runze Gong; Jiacheng Zhou; Zhi Wu; Nu Yan Purpose Ball grid array (BGA) package is prone to failure issues in a thermal vibration-coupled environment, such as deformation and fracture of solder joints. To predict the minimum equivalent stress of solder joints more...
