...Rafael Kakitani; Cassio Augusto Pinto da Silva; Bismarck Silva; Amauri Garcia; Noé Cheung; José Eduardo Spinelli Purpose Overall, selection maps about the extent of the eutectic growth projects the solidification velocities leading to given microstructures. This is because of limitations of most...

... of voids in the interconnecting eutectic solder balls of these packages. Large voids can affect the mechanical and thermal properties of the interconnect, which can reduce a component’s mean time‐to‐failure and may also affect the transmission of high frequency electrical signals through the solder ball...

...Se‐Young Jang; Kyung‐Wook Paik In flip‐chip interconnection on organic substrates using eutectic tin/lead solder bumps, a highly reliable under bump metallurgy (UBM) is required to maintain adhesion and solder wettability. Various UBM systems such as 1μm Al/0.2μm Ti/5μm...