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Keywords: Fatigue life
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Journal Articles
Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2021) 33 (5): 249–257.
Published: 08 February 2021
... and fatigue life of the lead-free solder materials. The analyses of the results showed that SAC405 is more reliable than SAC396. This was evident in the fatigue life analysis where it was predicted that it took about 85 days for SAC405 to fail, whereas it took about 13 days for SAC396 to fail. Therefore...
