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Keywords: Fault analysis
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2000) 12 (1): 35–39.
Published: 01 April 2000
... problems. © MCB UP Limited 2000 Fault analysis Electronic packing Multi‐chip module Flip chip There are four principal categories of stacking technologies for 3D‐modules (e.g. Crowley, 1998): 1. 1 stacking of bare dies: 2. 2 stacking of packaged chips: 3. 3...
