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Keywords: Fault analysis
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2000) 12 (1): 35–39.
Published: 01 April 2000
... for stress and strain measuring and daisy chains for conduction path monitoring. © MCB UP Limited 2000 Fault analysis Electronic packing Multi‐chip module Flip chip The succeeding reduction of size, weight, and volume of electronic packages and integrated circuits leads to performance...
