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Keywords: Finite volume method
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2022) 34 (4): 193–202.
Published: 15 December 2021
... → ) = 0 , Flip-chips Finite volume method Underfill encapsulation Electronic packaging Voiding Recent advances in the microelectronics sector have demanded a smaller and more compact electronic device with higher performance, preferably at a lower manufacturing cost. Therefore...
