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Keywords: Finite-element method
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 1–9.
Published: 12 October 2026
... 13 09 2026 © 2026 Emerald Publishing Limited 2026 Emerald Publishing Limited Licensed re-use rights only Die-attach void Electronic packaging Interconnect reliability Finite-element method LED package Thermal resistance The die-attach layer is a main heat-flow path...
Includes: Supplementary data
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (3): 167–182.
Published: 22 June 2012
... Heat transfer Computer software Thermal‐coupling method Forced‐convection reflows Computational fluid dynamics Finite‐element method Heat‐transfer coefficient An offline tool for the reflow process will be greatly useful to the electronics manufacturing industry. Therefore, modelling...
