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1-2 of 2
Keywords: Flip chip bumping
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2018) 30 (1): 42–48.
Published: 18 December 2017
... p denotes the PSFE of the solid, σ l d means the dispersive surface tension of the liquid and σ l p symbolizes the polar surface tension of the liquid. Wettability Lead-free solder Flip chip bumping Surface free energy Ar-H2 plasmas Aluminum oxides...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (3): 183–190.
Published: 22 June 2012
... energies) (Owens and Wendt, 1969). The Owens‐Wendt method was derived from Young's equation, shown in the following equations. Surface properties of materials Copper Flow Solder Wettability Lead‐free solder Flip chip bumping Ar‐H2 plasmas Surface energy Solder bump flip chip...
