...Soufyane Belhenini; Imad El Fatmi; Caroline Richard; Abdellah Tougui Purpose This study aims to contribute to the numerical modelling of drop impact on a flip-chip component assembled on printed circuit boards using solder micro-bumps. This contribution is based on the introduction of non-linear...

...Fei Chong Ng; Mohamad Aizat Abas Purpose This paper aims to present new analytical model for the filling times prediction in flip-chip underfill encapsulation process that is based on the surface energetic for post-bump flow. Design/methodology/approach The current model was formulated based...

...Fei Chong Ng; Mohd Hafiz Zawawi; Mohamad Aizat Abas Purpose The purpose of the study is to investigate the spatial aspects of underfill flow during the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump (CLJ). Furthermore, a spatial-based void formation...

... in a flip‐chip on board (FCOB). Design/methodology/approach A 3D finite element procedure has been developed considering the material nonlinearity during solidification for a FCOB assembly. Finite element results have been compared with the experimental values. Findings The present finite element...

... temperature (Tg) of the adhesive films. The effects of high temperature and high humidity on the bond strength of flip‐chip‐on‐glass joints were evaluated by shear testing as well as by microstructural examination.It was found that aging generally caused a decrease in shear strength while the aging...

...David A. Hutt; Daniel G. Rhodes; Paul P. Conway; Samjid H. Mannan; David C. Whalley; Andrew S. Holmes As the demand for flip‐chip products increases, the need for low cost high volume manufacturing processes also increases. Currently solder paste printing is the wafer bumping method of choice...

...Adam A. Stanfield A feasibility study into alternative methods of producing interconnection between a PCB and flip‐chip has been undertaken. A number of initial ideas were investigated, the least promising being discarded at an early stage, while the ideas showing the greatest chance of success...

...Caroline Beelen‐Hendrikx; Martin Verguld As a result of the trend towards portable communication products, low‐cost miniaturisation is becoming increasingly important. One of the methods to achieve low‐cost miniaturisation is flip‐chip assembly on FR4 boards. In this paper, two types of flip‐chip...

...Se‐Young Jang; Kyung‐Wook Paik In flip‐chip interconnection on organic substrates using eutectic tin/lead solder bumps, a highly reliable under bump metallurgy (UBM) is required to maintain adhesion and solder wettability. Various UBM systems such as 1μm Al/0.2μm Ti/5μm...

...Bela Roesner Recently several low‐cost alternatives for flip‐chip interconnection technology have been investigated. The scope of this paper is a reliability study of flip‐chip assemblies on various substrates (mainly FR4). The deterioration (characterised by the electrical resistance...