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Keywords: Forced convection reflow
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (2): 77–91.
Published: 06 April 2012
...Chun‐Sean Lau; M.Z. Abdullah; F. Che Ani Purpose The purpose of this paper is to develop a thermal coupling method of a ball grid array (BGA) assembly during a forced convection reflow soldering process. Design/methodology/approach The reflow oven was modeled in computational fluid dynamic...
