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Keywords: Growth behavior
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Journal Articles
Growth behaviors of tin whisker in RE‐doped Sn‐Zn‐Ga solder
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Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2013) 25 (3): 139–144.
Published: 21 June 2013
...Huan Ye; Songbai Xue; Cheng Chen; Yang Li Purpose The purpose of this paper is to investigate the growth behavior and mechanism of Sn whisker induced by RE addition in Sn‐Zn‐Ga‐Pr solder at ambient condition. Design/methodology/approach By means of aging treatment, FIB and SEM microstructure...
