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Keywords: Growth rate
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (2): 65–72.
Published: 06 November 2019
... has retarded the Cu6Sn5 intermetallic growth rate by increasing its activation energy from 97.86 to 101.45 kJ/mol. Furthermore, the activation energy for the Cu3Sn growth has increased from 102.10 to 104.23 kJ/mol. Originality/value The increase in the activation...
