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Keywords: Heat Dissipation
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2026) 38 (2): 140–145.
Published: 25 December 2025
... introduction to the application of thermal conductivity adhesives for epoxy and silicone. The purpose of this study was to explore high-efficiency thermal adhesive solutions and meet the heat dissipation requirements of high-end electronic components. Design/methodology/approach Heat dissipation was one...
