...Hongbo Xu; Mingyu Li; Yonggao Fu; Ling Wang; Jongmyung Kim Purpose The purpose of this paper is to describe a local melt process of solder bumping employed in electronic packaging applications by an induction heating reflow method, for a combined numerical and experimental study involving...

...Hongbo Xu; Mingyu Li; Yonggao Fu; Ling Wang; Jongmyung Kim Purpose The aim of the paper is to control the height and shape of solder interconnects employed in electronic packaging applications by an induction heating reflow method, which can achieve the solder bumping and interconnecting process...

...Jin Gang Gao; Yi Ping Wu; Han Ding; Nian Hong Wan Purpose This paper aims to offer a convenient method to develop an oven recipe for a specific soldering profile in a reflow process. The method is devised to quickly achieve proper profile shape and heating factor Q_η...