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Journal Articles

Lifetime prediction and design aspects of reliable lead-free non-collapsible BGA joints in LTCC packages for RF/microwave telecommunication applications

Jussi Putaala, Olli Salmela, Olli Nousiainen, Tero Kangasvieri, Jouko Vähäkangas, Antti Uusimäki, Jyrki Lappalainen
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (3): 117–128.
https://doi.org/10.1108/SSMT-07-2013-0018
Published: 27 May 2014
...-SEM are listed in the discussion section. Jussi Putaala can be contacted at: jussi.putaala@ee.oulu.fi © Emerald Group Publishing Limited 2014 Reliability Thermal fatigue Engelmaier’s model High frequency Lead-free solders Low temperature co-fired ceramics (LTCC) Low...
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