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Keywords: Induction
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (4): 45–54.
Published: 18 September 2009
...Hongbo Xu; Mingyu Li; Yonggao Fu; Ling Wang; Jongmyung Kim Purpose The purpose of this paper is to describe a local melt process of solder bumping employed in electronic packaging applications by an induction heating reflow method, for a combined numerical and experimental study involving...
