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Keywords: Innovation
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (1): 38–50.
Published: 03 February 2012
... innovations in the art of stencil printing for microelectronics packaging are examined as each part of the printing process is explained. Originality/value Stencil printing is currently the cheapest and highest throughput technique to create the mechanical and electrically conductive connections between...
