Keywords: Interconnect
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Journal Articles
Soldering & Surface Mount Technology (2020) 32 (1): 33–41.
Published: 25 June 2019
...D.K. Kharbanda; N. Suri; P.K. Khanna Purpose The purpose of this paper is to explore a new possibility of providing high-temperature stable lead-free interconnections for low-temperature co-fired ceramics (LTCC) hotplate. For gas-sensing application, a temperature range of 200°C-400°C is usually...
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