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Keywords: Interconnect
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Journal Articles
Electro-thermal simulation and fabrication of LTCC hotplate with lead-free interconnects
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (1): 33–41.
Published: 25 June 2019
...D.K. Kharbanda; N. Suri; P.K. Khanna Purpose The purpose of this paper is to explore a new possibility of providing high-temperature stable lead-free interconnections for low-temperature co-fired ceramics (LTCC) hotplate. For gas-sensing application, a temperature range of 200°C-400°C is usually...
Journal Articles
Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (2): 120–126.
Published: 06 April 2012
... different loading rates and temperatures. Gang Chen can be contacted at: agang@tju.edu.cn © Emerald Group Publishing Limited 2012 Joining processes Sintering Mechanical properties of materials Shear strength Nano‐silver paste Interconnect Single lap shear Temperature dependent...
