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Keywords: Interconnect packaging
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 1–19.
Published: 01 January 2026
...Siyu Chen; Deyi Chen; Yiqian Huang; Ruijie Liu; Xinyuan Wang; Ben Tian; Jianming Xu; Yun Mou Purpose This paper aims to systematically review the directional transfer and low-temperature interconnect packaging of nano metal materials, analyze their sintering mechanism, transfer methods...
