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1-4 of 4
Keywords: Intermetallic compound (IMC)
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2024) 36 (5): 285–295.
Published: 31 July 2024
... are also investigated to correlate the microstructural changes with tensile properties of the solder alloys. Then, the thermal aging performances of the solder alloys are investigated in terms of their intermetallic compound (IMC) layer morphology and thickness. Design/methodology/approach The Sn-58Bi...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2024) 36 (1): 30–38.
Published: 19 September 2023
... 30 05 2023 28 07 2023 11 08 2023 23 08 2023 24 08 2023 © Emerald Publishing Limited 2023 Emerald Publishing Limited Licensed re-use rights only Diffusion controlled Intermetallic compound (IMC) Liquid/solid reaction couple technique SnZn/C1990 HP couple Sn...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (2): 85–91.
Published: 03 April 2017
...Yan Zhu; Fenglian Sun Purpose The purpose of this paper is to investigate the effect of geometric size on intermetallic compound (IMC) growth and elements diffusion of Cu/Sn/Cu solder joint and establish the correlation model between the thickness of the IMC layer and size of the solder joint...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (3): 140–149.
Published: 28 June 2011
...M.M. Arafat; A.S.M.A. Haseeb; Mohd Rafie Johan Purpose In electronic packaging, when solid copper comes in contact with liquid solder alloy, the former dissolves and intermetallic compounds (IMCs) form at the solid‐liquid interface. The purpose of this paper is to study the effect of the presence...
