... applications to solder joint engineering, structured around three interconnected thrusts: (1) microstructure informatics encompassing automated segmentation and generative modelling, (2) predictive reliability modelling including physic-informed neural networks and surrogate models, and (3) inverse design...

... of data-driven inverse design, which couples adaptive surrogate model technology with optimization algorithm to to enable an efficient and accurate inverse design of electronic packaging structures. Design/methodology/approach The multisurrogate accumulative local error-based ensemble forward...