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Keywords: LED package
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 1–9.
Published: 12 October 2026
...Viet-Dung Le Purpose This study aims to quantify the effects of die-attach void fraction and in-plane position on heat flow in a high-power phosphor-converted LED package. Design/methodology/approach The model was run in MATLAB R2025b with the Partial Differential Equation Toolbox...
Includes: Supplementary data
