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Keywords: Land grid array (LGA)
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2023) 35 (4): 244–254.
Published: 11 May 2023
...Mohammad A. Gharaibeh; James M. Pitarresi Purpose Because of growing demand for slim, thin and cheap handheld devices, reduced-volume solder interconnects like land grid array (LGA) are becoming attractive and popular choices over the traditional ball grid array (BGA) packages. This study aims...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (2): 77–84.
Published: 22 November 2018
...Mohammad Gharaibeh; Aaron J. Stewart; Quang T. Su; James M. Pitarresi Purpose This paper aims to investigate and compare the reliability performance of land grid array (LGA) and ball grid array (BGA) solders, as well as the SAC105 and 63Sn37Pb solder alloys, in vibration loading conditions...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (2): 99–109.
Published: 03 April 2017
.... It is also recognized that the solder paste printing process is wholly responsible for the solder joint formation of leadless package technologies such as land grid array (LGA) and quad-flat no-lead (QFN) components and therefore is a determining factor in the long-term reliability of said devices. The aim...
