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Keywords: Large-Scale integrated circuits
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Journal Articles
L-shaped epoxy reinforcement optimization for vibration reliability of microspring array pins in aerospace large-scale integrated circuits
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2026) 38 (4): 245–256.
Published: 28 May 2026
... to inducing microspring fracture, thereby compromising the operational safety of electronic systems. This study aims to post-printed circuit board-assembly reinforcement schemes for large-scale integrated circuits to enhance the anti-vibration performance of microspring array interconnections under extreme...
