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Keywords: Lattice Boltzmann method
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (3): 147–156.
Published: 04 February 2020
... encapsulation process by mean of experimental and numerical method. Design/methodology/approach Lattice Boltzmann method (LBM) numerical was used for the three-dimensional simulation of underfill process. The effects of ball grid arrays (BGA) encapsulation process in terms of filling time of the fluid were...
