...Min Wu; Bailin Lv Purpose Viscosity is an important basic physical property of liquid solders. However, because of the very complex nonlinear relationship between the viscosity of the liquid ternary Sn-based lead-free solder and its determinants, a theoretical model for the viscosity of the liquid...

...Muhamad Zamri Yahaya; Ahmad Azmin Mohamad Purpose This paper aims to cover the recent (2010-2016) techniques for carrying out hardness evaluation on lead-free solders. Details testing configuration/design were compiled and discussed accordingly to each of the measurement techniques: Vickers...

...Jussi Putaala; Olli Salmela; Olli Nousiainen; Tero Kangasvieri; Jouko Vähäkangas; Antti Uusimäki; Jyrki Lappalainen Purpose – The purpose of this paper is to describe the behavior of different lead-free solders (95.5Sn3.8Ag0.7Cu, i.e. SAC387 and Sn7In4.1Ag0.5Cu, i.e. SAC-In) in thermomechanically...

... turnaround time, and greater cost saving opportunities. © Emerald Group Publishing Limited 2013 Surface‐mount technology Laser‐cut stencil Electropolishing Tin Alloys Lead‐free solders 01005 chip components System‐in‐package System‐in‐package (SiP) modules are becoming increasingly...