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Keywords: Light emitting diode
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Journal Articles
Investigation of oxygen followed by argon plasma treatment on LED chip bond pad for wire bond application
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2015) 27 (4): 129–136.
Published: 07 September 2015
... interfacial adhesion improvement. The aim of this study is to resolve the “lifted ball bond” issue, which is one of the critical reliability checkpoints for light emitting diodes (LEDs) in automotive applications. Design/methodology/approach – Ar, O2 and O2→Ar plasma treatments...
