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Keywords: Low-temperature interconnection
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Journal Articles
Nanocopper-based low-temperature interconnection technology: advances in material systems, sintering mechanisms and packaging applications
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Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 1–23.
Published: 01 June 2026
...Ye Tian; Haojie Chen; Lushan Ma; Chao Wang; Ziqiang Li; Lei Ma; Yongfeng Dong; Xing Chen Purpose This paper aims to systematically summarize recent advances in low-temperature interconnection using Cu nanoparticles, nanoporous Cu and one-dimensional (1D) nanocopper arrays, clarify their advantages...
