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Keywords: MCPCB
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Journal Articles
Janusz Sitek, Aneta Araźna, Kamil Janeczek, Wojciech Stęplewski, Krzysztof Lipiec, Konrad Futera, Piotr Ciszewski
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2015) 27 (3): 120–124.
Published: 01 June 2015
... heat conductors. The thermal conductivity coefficient (λ) is at the level of 200 W/m·K (by comparison, the λ for FR-4 laminate is about 0.26 W/m·K). Therefore, the substrate itself can act as a heat sink. PCB/IMS circuits (metal core printed circuit boards – MCPCBs) are characterized by a uniform...
