...Balázs Illés; Attila Géczy; Bálint Medgyes; Gábor Harsányi Purpose This paper aims to present a review of the recent developments in vapour phase soldering (VPS) technology. This study focuses on the following topics: recent developments of the technology, i.e. soft and vacuum VPS; measurement...

...Milosˇ Dusˇek; Christopher Hunt The printing process is the most critical step in surface mount assembly. To control and monitor printing, complex instrumentation is available for measuring the print consistency. This paper describes a novel robust method, which introduces critical variables...

... © MCB UP Limited 2001 --> MV Technology Measurement MV Technology launches new FX-B benchtop measurement system Keywords: MV Technology, Measurement MV Technology Ltd has launched the new FX-B bench-top flux inspection and measurement system for process set-up...

... Keywords NPL, Electronics, Assembly, Temperature, Measurement, Monitoring The electronics industry world-wide has begun the move to eliminate lead from its manufacturing process. However, the increased wave and reflow soldering temperatures associated with the new alternative alloys means...

... © MCB UP Limited 2000 --> NPL Benchmarking Solder paste Measurement Finishing Components NPL announces two collaborative projects with industry Keywords NPL, Benchmarking, Solder paste, Measurement, Finishing, Components The National Physical Laboratory...

... © MCB UP Limited 1999 --> Controlled impedance ECT Measurement ECT introduces "The Edge" flying prober with optional automated TDR measurement capability Keywords Controlled impedance, ECT,Measurement ECT offers a new flying probe test system with the industry's...

...W. Liggett; K.‐W. Moon; C. Handwerker An experimental method for measurement system improvement is presented and applied to development of a protocol for solderability measurement with a wetting balance. Protocol development is central to development of reliable monitoring systems for manufacturing...

... performed in 50°C/90%RH environmental conditions. Printed circuit boards and assemblies were fluxed and exposed to a 50°C/90%RH chamber to assess long‐term reliability. To evaluate the corrosion rates of copper and solder sheets in as‐ received liquid fluxes, electrochemical polarisation measurements were...