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Keywords: Meniscus evolution
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2021) 33 (2): 112–127.
Published: 05 September 2020
...Fei Chong Ng; Mohd Hafiz Zawawi; Mohamad Aizat Abas Purpose The purpose of the study is to investigate the spatial aspects of underfill flow during the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump (CLJ). Furthermore, a spatial-based void formation...
