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Keywords: Microbump joint
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 1–16.
Published: 27 January 2026
...Chu Tang; Zhuo Chen; Wenhui Zhu Purpose The purpose of this study is to investigate the failure mechanisms of thermal migration in microbump joints with limited Sn grains under temperature gradients and to assess the effectiveness of hourglass structures in suppressing intermetallic compound ( IMC...
