...); delayed elasticity; and viscous flow (deformation increases linearly for a given time and then rapidly leads to failure). Fatigue Microelectronics packaging Creep Failure analysis Microindentation Fundamental properties of solder joints like electrical signal transmission, heat...

...Robert Kay; Marc Desmulliez Purpose The purpose of this paper is to present a detailed overview of the current stencil printing process for microelectronic packaging. Design/methodology/approach This paper gives a thorough review of stencil printing for electronic packaging including...