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Keywords: Microelectronics packaging
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (1): 22–26.
Published: 28 January 2014
... be contacted at: krystian.jankowski@pwr.wroc.pl © Emerald Group Publishing Limited 2014 Fatigue Microelectronics packaging Creep Failure analysis Microindentation Fundamental properties of solder joints like electrical signal transmission, heat transportation and structural support...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (1): 38–50.
Published: 03 February 2012
...Robert Kay; Marc Desmulliez Purpose The purpose of this paper is to present a detailed overview of the current stencil printing process for microelectronic packaging. Design/methodology/approach This paper gives a thorough review of stencil printing for electronic packaging including...
