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Keywords: Microstructure stability
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Journal Articles
Effect of TiO2 nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2023) 35 (1): 18–27.
Published: 25 April 2022
... is an effective method to enhance new solder joints. Practical implications New solder alloys. Originality/value Development of TiO2 NPs-doped eutectic SAC355 lead-free solder for electronic packaging. Melt-spun process Microstructure stability Nano-reinforced lead-free solder SAC355...
