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Keywords: Mo nanoparticles
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Journal Articles
Interfacial reaction and dissolution behavior of Cu substrate in molten Sn‐3.8Ag‐0.7Cu in the presence of Mo nanoparticles
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Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (3): 140–149.
Published: 28 June 2011
... of molybdenum nanoparticles on the dissolution of copper and the formation of interfacial IMC. Design/methodology/approach Cu wire having a diameter of 250 μm is immersed in liquid composite solders at 250°C up to 15 min. Composite solder was prepared by adding various amount of Mo nanoparticles...
