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Keywords: Moulding compound
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1998) 10 (3): 6–11.
Published: 01 December 1998
... shows the longitudinal change for a different type (type B) of a SOP 32 package, made with a different moulding compound. As above, the dry component does not exceed the 3 per cent limit, and no cracks or delaminations are found. A small increase of moisture changes component behaviour, so...
